Trends • More complex multilayer, multifunctional RF boards • Higher integration of different technologies like RF and Multichip Modules (MCM), die-in-board,... • 3D Stacking of board laminates with Multichip Modules and RF wireless technologies
ug230_Spartan 3E FPGA Starter Kit Board User Guide.pdf Xilinx公司2011年1月20日版 This user guide describes the components and operation of the Spartan®-3E FPGA Starter Kit Board. The Starter Kit provides a low-cost, easy-to-use development and evaluation
