Over the past decade, system-on-chip (SoC) designs have evolved to address the ever increasing complexity of applications, fueled by the era of digital convergence. Improvements in process technology have effectively shrunk board-level components so
usb2.0的低功耗解决方案---The DesignWare USB HSIC solution is ideal for applications such as 3G/4G handsets, smartphones, set-top boxes and mobile internet devices. compared to the existing USB 2.0 enabled and suspend modes, thereby allowing devices to save
The Original USB 2.0 specification released on April 27, 2000 USB 2.0 Adopters Agreement Errata to the USB 2.0 specification as of December 7, 2000 Mini-B connector Engineering Change Notice to the USB 2.0 specification Pull-up/pull-down Resistors E
IntelMausiEthernet OS X driver for Intel onboard LAN A few days before Christmas I started my latest project, a new driver for recent Intel onboard LAN controllers. My intention was not to replace hnak's AppleIntelE1000e.kext completely but to deliv
The USB 3.2 Specification released on September 22, 2017 USB 3.1 Legacy Cable and Connector Specification as of September 22, 2017 USB 3.0 Adopters Agreement On-The-Go and Embedded Host Supplement to the USB Revision 3.0 Specification Revision 1.1 a
The Original USB 2.0 specification released on April 27, 2000 USB 2.0 Adopters Agreement Errata to the USB 2.0 specification as of December 7, 2000 Mini-B connector Engineering Change Notice to the USB 2.0 specification Pull-up/pull-down Resistors E
USB 官方协议文档，包含
| USB 3.1 Appendix E Rev1.0.pdf
| USB 3.1 Specification Welcome Message - Oct 2014.pdf
| USB 3_0 Adopters Agreement Final_020411.pdf
| USB_3_1_r1.0.pdf
| USB_OTG_and_EH_3-0_release_1_1_10May2012.pdf
|
+---SuperSpeed I
HSIC High-Speed Inter-Chip USB Electrical Specification 官方文档High-Speed Inter-Chip USB vsn 1.0
September 23, 2007
The 1.0 revision of the specification is intended for product design. Every attempt has been made to
ensure a consistent and implementabl
We propose novel double-notch-shaped microdisk resonator-based devices with gapless waveguide-to-microdisk and inter-cavity coupling via the two notches of the microdisk. Both finite-difference time-domain simulations and experimental demonstrations
