Introduction Point-to-point designers face many challenges when laying out a new printed circuit board (PCB). The designer may need to arrange groups of devices within a certain area of the PCB, to place components away from critical keep-out zones,
We propose a new laser preparation technique to solder Sn-Ag3.5-Cu0.7 on a copper clad laminate (CCL). The experiment is conducted by selective laser heating and melting the thin solder layer and then preprinting it on CCL in order to form the matrix
