© 1999-2048 dssz.net 粤ICP备11031372号
[其它] 镁光 DRAM HMC 规则 带宽160GB/s
说明: Hybrid Memory Cube (HMC) is a single package containing four DRAM die and one logic die, all stacked together using through-silicon via (TSV) technology. Within each cube, memory is organized vertically— portions of each memory die are combined with<xruirui> 上传 | 大小:1mb