IMS2019 _WSC_1_Antenna-IC Interfaces for 5GAntenna

文件名称: IMS2019 _WSC_1_Antenna-IC Interfaces for 5G

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上传时间: 2019-09-07

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详细说明：Antenna-IC Interfaces for Scalable mm-Wave Arrays for 5G and Beyond-5G Applications 抛砖引玉ite Wavelength-Scale Integrated Circuits at mm-Wave E BCOSTONE THE HUB OFMCROWAVES 24GHz 4-element Transmitter 77GHz 4-element ransceiver 0.5424GHz[6.8mm 1.7577GHz[68mm Radiating 017 elements 24GHz 97 2. 1mm l 77GHz [38mm [ssc2005] UJSSC 2006] Circuit desig您 System design and 60GHz 16-element Receiver 94GHz 16-element Transceiver 12)60GHz[608mm -22A94GHz test 124) 2.27 60GHz 94GHz 6.2mm Novel array approaches possible with co design of EM interfaces and mm-wave ICs USSC 20111 [TMTT 2015] ◆EEE入 OIMS The 20.9 IEEE MIT-5 International Microwave Symposium 2-7 June 2019 Beston, M WSC 1 E-a Unit-Cell Approach to Arrays ARRF BCOSTONE THE HUB OFMICROWAVE H16 v16 Dual-polarization W-band W-band 16-element dual- Phased Array Frontend polarization tx and RX KATXIR/16 Frontend 94-GHZ 94-GHz o bmm Elements TX/RX contend Frontend JH-Pol Combiner/Splitter V-Pol Combiner/Splitter e-E Natarajan et al., IEEE TMTT, 2015 40 GHz X2 Upconverter ■昍口 PLL Downconverter Baseband PLL igit RX TX IN [IBM Research REF OUT 64-element W-Band Array with four ICs in package ◆6令 34 ◆EEE入 OIMS The 20.9 IEEE MIT-5 International Microwave Symposium 2-7 June 2019 Beston, M WSC 1 Dual-Polarization transceivers ARRF BCOSTONE THE HUB OFMCROWAVES Antenna Antenna Radio Wave Antenna Radio wave Radio wave Horizontal Polarized Vertical Polarized Dual Polarized Dual-pol transmit/receive capabilit needed for communication and radar ◆EEE入 The 20.9 IEEE MIT-5 O)IMS International WSC 1 i Scalable RF/mmWave MIMO Arrays ARRF BCOSTON THE HUB OFMCROWAVES 64-element 94GHz array 288-element 94GHz array 144-element 60GHz array [IBM Research [Bell Labs radcom 14.1mm : 自自自自自 88昌888 门自自自 ④ 2 Front Back 162mm 162mm 6.7mm 423mm Scalable Phased Arrays and Scalable MIMO Arrays Challenges Antenna-IC CO-integration and meeting n/2xn/2 fill factor Transmitter array efficiency under modulation low-loss packages LO and if interfaces and resultant package complexity 令EEE入 OIMS The 20.9 IEEE MIT-5 International Microwave Symposium 2-7 June 2019 Beston, M WSC 1 it Scalability at RF Interface: Antenna-In-Package E BCOSTONE THE HUB OFMCROWAVES PCB with antennas Antennas-in-package 1st-level package tiles PCB with with em bed ded antenna [IBM RESEARCH] embedded antenna 2nd-level [Gu, IEEE Comm. Mag 2015 RF chi Ip Heat sink Stacked Pa M1 g Patch Antenna GND M6 MS Line GND Power Plane Chip GND M11 M12 VAntenna-in-package enables scalability>tiling of AiP with high element density; high antenna efficiency XIF, DC, and control Io lead to multi-layer package Impedance control and accurate via registration required for mm-wave traces increased cost X Routing density Fill factors <70% ◆EEE入 OIMS The 20.9 IEEE MIT-5 International Microwave Symposium 2-7 June 2019 Beston, M WSC 1 Challenges for On-Chip Antennas ARRF BCOSTONE Topside Radiation: Poor Efficiency. Topside Radiation M1 Ground Plane →Air,Er c10um height between antenna and ground plane →SiO2,E~4 > low radiation resistance Si,Er=11.7, bandwidth/efficiency degraded p=1092cm Air, Er-1 h-10μI Sio 2 Pear Si,Er=11.7 109-cm total r On-chip antenna requires high-res substrates, techniques to overcome BW constraints ◆EEE入 OIMS The 20.9 IEEE MIT-5 International Microwave Symposium 2-7 June 2019 Beston, M WSC 1 Off-chip Superstrate and Substrate Lens a BCOSTONE THE HUB OFMCROWAVES Topside Radiation: Off chip superstrate lens Backside Radiation: Substrate Lens Efficiency improved by quartz superstrate Efficiency improved by suppressing c50% efficiency, 7.5% BW substrate waves Microstrip Slot-ring r, Er Quartz antenna antenna SiO2, Er-4 superstrate Si,Er=11.7 On-chip p=1022-cm Silicon SiO2 ground Lens plane Silicon substrate SiGe/CMOS Differential on-chip ch nlp feed-line From yc ou and g. m. rebeiz. EEE Trans. On A. Babakhani, X Guan, A. Komijani, A Natarajan Antennas and Prop. June 2012 and A. hajimari, IEEE JSSC, Dec. 2006 Superstrate and substrate approaches promising Mechanical robustness and wafer-scale compatibility required for low-cost ◆EEE入 OIMS The 20.9 IEEE MIT-5 International Microwave Symposium 2-7 June 2019 Beston, M WSC 1 IC Antenna array Scalability challenges ARRF BCOSTONE THE HUB OFMCROWAVES 1000 IBM On-chip UCSD Super Infineon Lambda/2 x Lambda/ 2 LTCC Loop [IsSCC 18 strate eWLB O Reported silicon Arrays Bandwidth 10 GHZ 20GHz 3GHz 7GHz EE 94 GHZ 74 GHZ 60GHz 60GHz 100 n= PRad/PTx ~57% >80% 50% ~70% Fill Factor 64% NA 100% 100% Only TX/RX FE Not scalable Area Reuse For 10 NA Circuits NA Wafer-scale Pkg. Dual-pol Multi-Feed Metal Fill 0102030405060708090100 Frequency of operation gHz) Antenna-IC CO-integration and meeting 2/2x2/2 fill factor Transmitter array efficiency under modulation >low-loss packages LO and iF interfaces and resultant package complexity ◆EEE入 OIMS The 20.9 IEEE MIT-5 International Microwave Symposium 2-7 June 2019 Beston, M WSC 1

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