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详细说明：小封装温度传感器，三端口，+5V供电，温度范围-40~+150摄氏度TMP35/TMP36/TMP37
ABSOLUTE MAXIMUM RATINGS1, 2, 3
FUNCTIONAL DESCRIPTION
Supply voltage
7V
An equivalent circuit for the tMP3x family of micropower
Shutdown pin
GND S SHUTDOWN S +Vs centigrade temperature sensors is shown in Figure 2. At the
Output pin
GND S VOUT 5+Vs hcart of the tcmpcraturc sensor is a band gap corc, which is
perating l emperature range
-55C to +150c comprised of transistors Ql and Q2 biased by Q3 to approxi-
Dice junction Temperature
175C mately 8 A. The band gap core operates both Ql and Q2 at the
Storage Temperature Range
65C to+160c same collector current level; however, since the emitter area of
Lead Temperature (Soldering, 60 sec
300c Q1 is 10 times that of Q2, Q1's vbe and Q2,s vbe are not equal
NOTES
by the following relationsh
Stresses above those listed under absolute Maximum ratings may cause perma
nent damage Lo the device. This is a stress raling unly; funcTional operalion at or
above this specification is not implied. Exposure to maximum rating conditions for
△p
BE
extended periods may affect device reliability
(AE,Q2)
"Digital inputs are protected; however, permanent damage may occur on unpro-
tected units from high energy electrostatic fields. Keep units in conductive foa
or packaging at all times until ready to use. Use proper antistatic handling
procedures
Remove power before inserting or removing units from their sockets
SHDN
Package Typ
61A
C
Unit
0-92(T9 Suffi
162
120
SOIC-8(s Suffi
158
43
C/W
SOT-23 (RT Suffix)
300
l80
BJA is specified for device in socket(worst-case conditions)
ORDERING GUIDE
10X
accura
Linear
at 25.cOperating
Package
Model
(C max)I Temperature Range Options
+75A
TMP35FT
10°Cto125°C
TO
TMP35GT9±3.0
10°Cto125°
TO-92
2X
TMP35FS±20
10°Cto125°C
RN-8
GND
TMP35GS±3.0
10°Ctol25°C
R、-8
TMP35GRT±3.0
10°Cto125°C
RT-5
Figure 2. Temperature Sensor Simplified
Equivalent Circuit
TMP36FT9±2.0
40°Cto+125C
TO-92
TMP36GT9±3.0
40°Cto+125°C
TO-92
Resistors ri and r2 are used to scale this result to produce the
TMP36FS
±2.0
40°Cto+125°C
RN-8
output voltage transfer characteristic of each temperature sensor
TMP36GS
±3.0
40Cto+125C|RN-8
and, simultaneously, R2 and r3 are used to scale QI's Vbe as
TMP36GRT2±3.0
40°Cto+125°C
RT-5
an offset term in vout. Table I summarizes the differences
between the three temperature sensors' output characteristics
TMP37FT9±2.0
5°Cto100°C
To-92
TMP37GT9±3.0
5°Cto100°C
To-92
Table I. TMP3x Output Characteristics
TMP37FS±2.0
5°Cto100°C
RN-8
TMP37GS
±3.0
5°Cto100°C
RN-8
Offset
Output voltag
Output Voltage
TMP37GRT2±3.0
5°Cto100°C
RT-5
ensor
Voltage(V) Scaling(mv/oC)25C(mV)
NOTES
TMP350
250
SOIC Small Outline Integrated Circuit; RT= Plastic Surface Mount
TMP360.5
10
TO= Plastic
TMP370
20
500
Consult factory for availability
The output voltage of the temperature sensor is available at the
emitter of Q4, which buffers the band gap core and provides
load current drive Q4s current gain, working with the available
base current drive from the previous stage, sets the short-circuit
current limit of these devices to 250 LA
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and tcst cquipmcnt and can discharge without dctection AlthougI
WARNING!
the TMP35/TMP36/TMP37 features proprietary ESd protection circuitry, permanent damage
may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality
ESD SENSITIVE DEVICE
REV C
3
TMP35/TMP36/TMP37-Typical Performance Characteristics
2.0
a. TMP35
18
b. TMP36
C. TMP37
31.6
1.6
s=3V
us->
1
1.0
0.8
Ouu>3
0.32
0.1
04
0.032
0.01
-50
100
10k
100k
TEMPERATURE-°c
FREQUENCY-Hz
TPC 1. Output Voltage vs. Temperature
TPC 4. Power Supply Rejection vs. Frequency
5
4
MINIMUM SUPPLY VOLTAGE REQUIRED TO MEET
3
4 DATA SHEET SPECIFICATION
a. MAXIMUM LIMIT (G GRADE)
NO LOAD
b. TYPICAL ACCURACY ERROR
C MINIMUM LIMIT(G GRADE)
1
0
2
3
a. TMP35/TMP36
b. TMP37
-5
60
80
100
140
125
TEMPERATURE-°C
TEMPERATURE°C
TPC 2. Accuracy Error vs Temperature
TPC 5 Minimum Supply Voltage vs. Temperature
0.4
V+=3v to 5.5V. NO lOAD
b. V+= 3V
NO LOAD
0.2
mu>o
>30
0.1
100125
TEMPERATURE-C
TEMPERATURE-°G
TPC 3. Power Supply Rejection vs Temperature
TPC 6. Supply Current vs Temperature
REV C
TMP35/TMP36/TMP37
TA=25"C, NO LOAD
SHUTDOWN PIN
HIGH TO LOW (3V TO ov)
三-o
SHUTDOWN PIN
LOW TO HIGH (OV TO 3v)
VOUT SETTLES WITHIN z1c
0
SUPPLY VOLTAGE-V
TEMPERATURE-C
TPC 7. Supply Current Vs Supply Voltage
TPC 10. VOU Response Time for Shutdown Pin vs
emperature
1.0
b. V+=3V
TA=25°c
0.6
NO LOAD
04
SHUTDOWN= L
SIGNAL
0.6
10
04
V+ AND SHUTDOWN
0
-25
100125
50050100150200250300350400450
TEMPERATURE°C
TPC 8. Supply Current vs Temperature (Shutdown =0 V
TPC 11. VouT Response Time to Shutdown and v+
Pins vs, Time
110
300
IN= 3V, 5V
V+ AND SHUTDOWN PINS
HIGH TO LOW (3V TO oV)
200
V+ AND SHUTDOWN pINs
uoLHz
LOW TO HIGH (OV To 3v)
VOUT SETTLES WITH|N±1°c
TMP35 To-9r 5
SOLDERED TO 0.5x0.3"Cu PCB
SOLDERED TO 0.6"x0.4 Cu PCB
IN SOCKET SOLDERED TO
50
100125
200
300
TEMPERATURE-°c
TIME-sec
TPC 9. VOuT Response Time for V+ Power-Up/Power-
TPC 12. Thermal Response Time in Still Air
Down vs Temperature
REV C
5
TMP35/TMP36/TMP37
140
a. TMP35 SOIC SOLDERED To 0.5"x0.3 CU PcB
tOm v
120
b. TMP36 SoIC SOLDERED To 0.6"x0,4" Cu Pc
1ms
C. TMP35 TO-92 IN SOCKET SOLDERED TO
1"x0.4 CU PCB
80
o60
F40
300
400500
700
TIME/DIVISION
AIR VELOCITY -FPM
TPC 13. Thermal Response Time Constant in Forced Air
TPC 15. Temperature Sensor wideband output
Noise Voltage Gain= 100, BW= 157 kHz
110
2400
2000
VIN= 3V,5
b
1400
1000
a. TMP35 SOIC SoLDERED To 0.5"x0.3"Cu PcB
b. TMP36 SOIC SOLDERED TO 0.6"x0. 4 Cu PCB
600
TMP35 TO-92 IN SOCKET SOLDERED TO
1 x0.4 CU PCB
400a.TMP35/36
b. TMP37
50
00
TIME-sec
FREQUENCY-Hz
TPC 14. Thermal Response Time in Stirred Oil Bath
TPC 16. Voltage Noise Spectral Density VS Frequency
REV C
TMP35/TMP36/TMP37
APPLICATIONS SECTION
In the To-92 package, the thermal resistance junction-to-case,
Shutdown operation
Arc, is 120C/W. The thermal resistance case-to-ambient, AcA,is
All TMP3x devices include a shutdown capability that reduces the the difference between OJA and Brc, and is determined by the
power supply drain to less than 0.5 uA maximum. This fcaturc, characteristics of the thermal connection. The temperature
available only in the soIC-8 and the SoT-23 packages, is TT
sensor's power dissipation, represented by PD, is the product of
CMOS level compatible, provided that the temperature sensor the total voltage across the device and its total supply current
supply voltage is equal in magnitude to the logic supply voltage
including any current delivered to the load). The rise in die
Internal to the TMP3x at the ShutdoWn pin, a pull-up current temperature above the mediums ambient temperature is given by
source to VIN is connected. This permits the ShutdoWn pin to
be driven from an open-collector/drain driver. A logic LOW,or
T=Pb×(c+Oc)+
zero-volt condition on the ShuTdOWN pin, is required to turn
Thus, the die temperature rise of a TmP35"Rt package
the output stage OFF During shutdown, the output of the
mounted into a socket in still air at 25 C and driven from a 5v
tcmpcrature sensors becomes a high impedance state where the
potential of the output pin would then be determined by ext
supply is less than 0.04oC
terna
al
circuitry. if the shutdown feature is not used it is recommended
he transient response of the TMP3x sensors to a step change
that the shutdown pin be connected to VIN (Pin 8 on the
in the temperature is determined by the thermal resistances and
SOIC-8, Pin 2 on the soT-23)
the thermal cap
cities of the die.
d the case, Cc. The
The shutdown response time of these temperature sensors is
thermal capacity of the casc, Cc, varies with the measurement
medium since it includes anything in direct contact with the
illustrated in TPcs 9,10. and 11
package. In all practical cases, the thermal capacity of the case is
Mounting Considerations
the limiting factor in the thermal response time of the sensor
If the TMP 3x temperature sensors are thermally attached and
and can be represented by a single-pole rc time constant
protected, they can be used in any temperature measurement
response. TPCs 12 and 14 illustrate the thermal response time
application where the maximum temperature range of the
of the tmp3x sensors under various conditions. The thermal
medium is between-40C to +125 C. Properly cemented or time constant of a temperature sensor is defined as the time
glued to the surface of the medium, these sensors will be within
required for the sensor to reach 63.2% of the final value for a
0.01C of the surfacc tcmpcraturc. Caution should be exercised, step change in the temperature For cxamplc, the thermal time
especially with To-92 packages, because the leads and any
constant of a TMP35S package sensor mounted onto a 0.5
wiring to the device can act as heat pipes, introducing errors if by 0.3 "PcB is less than 50 sec in air, whereas in a stirred oil
the surrounding air-surface interface is not isothermal. avoiding bath, the time constant is less than 3 seconds
this condition is easily achieved by dabbing the leads of the
Basic Temperature Sensor Connections
temperature sensor and the hookup wires with a bead of
Figure 4 illustrates the basic circuit configuration for the
thermally conductive epoxy. This will ensure that the TMP3x
TMP3x family of temperature sensors. The table shown in the
die temperature is not affected by the surrounding air temperature
figure illustrates the pin assignments of the temperature sensors
Because plastic Ic packaging technology is used, excessive for the three package types. For the SoT-23, Pin 3 is labeled as
mechanical stress should be avoided when fastening the device "NC 'as are Pins 2, 3, 6, and 7 on the soic-8 package. It is
with a clamp or a screw-on heat tab. Thermally conductive epoxy recommended that no electrical connections be made to
or glue, which must be electrically nonconductive, is recommended these pins. If the shutdown feature is not needed on the
under typical mounting conditions
SOT-23 or the SoIC-8 package, the ShUtDOWN pin
These temperature sensors, as well as any associated circuitry,
should be connected to Vs
should be kept insulated and dry to avoid leakage and corrosion
27V80°c
80°C
16k9
F191
R4
CMP402
Figure 7. Pentium Overtemperature Interrupt Generator
Pentium is a registered trademark of Intel Corporation
-10
REV C
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